A Novel Low Power High Dynamic Threshold Swing Limited Repeater Insertion for On-chip Interconnects

نویسندگان

  • S. Rajendar
  • Asha Rani
چکیده

In Very Large Scale Integration (VLSI), interconnect design has become a supreme issue in high speed ICs. With the decreased feature size of CMOS circuits, on-chip interconnect now dominates both circuit delay and power consumption. An eminent technique known as repeater/buffer insertion is used in long interconnections to reduce delay in VLSI circuits. This paper deals with some distinct low power alternative circuits in buffer insertion technique and it proposes two new techniques: Dynamic Threshold Swing Limited (DTSL) and High Dynamic Threshold Swing Limited (HDTSL). The DTSL uses Dynamic Threshold MOSFET configuration. In this gate is tied to the body and it limits the output swing. High Dynamic Threshold Swing Limited (HDTSL) also uses the same configuration along with a high threshold voltage(high-Vth). The simulation results are performed in Cadence virtuoso environment tool using 45nm technology. By simulating and comparing these various repeater circuits along with the proposed circuits it is analyzed that there is trade off among power, delay and Power Delay Product and the 34.66% of power is reduced by using the highVth in HDTSL when compared to DTSL.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Efficient Interconnect Design with Novel Repeater Insertion for Low Power Applications

Length of interconnect and number of repeaters are increasing with the advancement in VLSI Technology. Requirement of repeaters is increasing as the length of interconnect is increasing. The power delay product and frequency of operation plays significant role in designing of repeater. Performance of earlier conventional repeater with the proposed sub-threshold grounded body (STGB) bias repeate...

متن کامل

Low Power Quasi-Resonant Interconnects

A primary challenge in high performance, high complexity integrated circuits is the on-chip interconnect [1]. Transmitting clock, data, and communications signals over large die areas requires long interconnections among the various circuit modules. Consequently, as technology scales, the interconnect cross section decreases while operating frequencies have increased. The impact of these trends...

متن کامل

Transceiver in 90 nm CMOS for 10 mm On - Chip Interconnects

The bandwidth of global on-chip interconnects in modern CMOS processes is limited by their high resistance and capacitance [1]. Repeaters that are used to speed up these interconnects consume a considerable amount of power [2] and area. Recently published techniques [1-4] increase the achievable data rate at the cost of high static power consumption, leading to relatively high energy per bit fo...

متن کامل

Driver Pre - emphasis Signaling for On - Chip Global Interconnects

ZHANG, LIANG LEON. Driver Pre-emphasis Signaling for On-Chip Global Interconnects (Under the direction of Professor Paul D. Franzon). Signaling design for high performance VLSI systems has become an increasingly difficult task due to the delay/noise limitation for on-chip global interconnects. Repeater insertion techniques are widely used to improve the signal bandwidth of interconnect channels...

متن کامل

Towards low-power yet high-performance networks-on-chip

A network-on-chip (NoC), the de-facto communication backbone in manycore processors, consumes a significant portion of total chip power, competing against the computation cores for the limited power and thermal budget. On the other hand, overall system performance of manycore chips increasingly relies on on-chip latency and bandwidth as core counts scale. This thesis aims to design low-power ye...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2014